|
Brightfield Patterned Wafer Defect Inspection Systems
Product Description
The 2830 Series brightfield inspection tools with PowerBroadband™ technology capture previously undetectable wafer defects and provide better discrimination between defects of interest and nuisance defects. This improved sensitivity to critical defects of interest is achieved at twice the data rate of the 281x predecessor, delivering the highest productivity brightfield inspection capability for faster resolution of process issues at the 3Xnm and 2Xnm design nodes. The 2830 and 2835 broadband brightfield inspection tools are part of a portfolio of advanced wafer defect inspection tools that accelerate the development and production ramp of leading-edge memory and logic devices.
- PowerBroadband, an exclusive, high-brightness light source, enables new optical modes that deliver increased resolution, contrast and layer penetration control for capture of a broader range of yield-critical defect types
- New optical modes, including the unique Broadband Directional E-Field™, provide improved top-layer discrimination and increased signal-to-noise, resulting in higher DOI capture and fewer nuisance defects
- A new image computer and PowerBroadband deliver the highest productivity brightfield inspection capability, enabling higher sensitivity in production, increased sampling for tighter process control, or lower cost of ownership
- Innovative XP option package utilizes IC design layout information to improve yield-relevant defect capture, accelerating the identification and resolution of process issues
- Upgradeability from 28xx brightfield wafer defect inspection tools provides fabs with a cost-efficient means to extend the performance of their existing brightfield inspectors
Applications
Lithography: The 2830 Series inspection tools use PowerBroadband and Broadband Directional E-Field to produce the high sensitivity and layer-penetration control required to detect critical pattern defects for after-develop inspection (ADI) and photo-cell monitoring (PCM) applications. The XP option package provides improved process window qualification (PWQ) performance, helping engineers to quickly identify sources of systematic yield loss throughout the lithography process module.
Etch: Used in critical etch line monitoring applications, the 2830 Series brightfield inspection tools with PowerBroadband and Broadband Directional E-Field capture micro-bridges, nano-bridges, bottom bridges, protrusions, and other yield-limiting etch defect types.
CMP: PowerBroadband and Broadband Directional E-Field improve top-layer discrimination on CMP layers for increased capture of voids and other critical CMP defects, enabling engineers to quickly find and fix yield-loss sources in the process module.
Contact Me >
Articles
Technical Publications
|
